In the aerospace industry, components must withstand extreme temperatures, aggressive fuels, hydraulic fluids, and pressure fluctuations while maintaining long-term sealing reliability. Kalrez® perfluoroelastomer parts, developed by DuPont™, are engineered to meet these rigorous demands—making them a trusted sealing solution in both commercial and defense aviation.
| Aerospace | Kalrez 4079 AMS | Kalrez 7745 |
| Maximum Service Temp., Deg. C | 316 | 240 |
| Shore A Hardness | 75 | 78 |
| Modulus @ 100%, Mpa | 7.24 | 7.18 |
| Tensile Strength, Mpa | 16.88 | 19.4 |
| Elongation, % | 150 | 175 |
| Color | Black | Off White |
| Compression set.,@70h | 25%@204 Deg.C | 26%@150 Deg.C |
Kalrez® perfluoroelastomer parts, are high-performance sealing solutions designed to meet the demanding requirements of the Food, Beverage, and Pharmaceutical industries. These industries demand excellent resistance to aggressive CIP/SIP chemicals, high temperatures, steam, and stringent cleanliness standards. Kalrez® offers exceptional durability, chemical resistance, and compliance with global food and pharma regulations.
| Pharmaceutical / Food &Beverages | Kalrez 6230 | Kalrez 6221 |
| Maximum Service Temp., Deg. C | 260 | 260 |
| Lowest Service Temp., Deg. C | -20 | -20 |
| Shore A Hardness | 75 | 70 |
| Modulus @ 100%, Mpa | 9.6 | 7.2 |
| Tensile Strength, Mpa | 16.5 | 15.2 |
| Elongation, % | 170 | 150 |
| Color | Black | White |
| Compression set,70h@204 Deg.C % | 26 | 31 |
| Linear Co-Efficient of Thermal Expansion | 2.89 E-4/Deg C | 3.07 E-4/Deg C |
| Retraction Temperature,. Deg.C | -3 | -4 |
In the Oil, Gas, and Petrochemical industries, sealing solutions are critical for safety, reliability, and operational efficiency in extreme conditions—such as high pressures, corrosive fluids, aggressive chemicals, and wide temperature fluctuations. Kalrez® perfluoroelastomer parts, deliver superior performance, helping operators reduce downtime, minimize fugitive emissions, and extend mean time between failures (MTBF).
Oil,Gas & Petrochemicals | Kalrez 0090 | Kalrez 0040 | Kalrez OG 193 |
Maximum Service Temp., Deg. C | 250 | 220 | 250 |
Lowest Service Temp., Deg. C | -21 | -42 | -31 |
Shore A Hardness | 95 | 70 | 94 |
Modulus %, Mpa | 14.2 @50% | 5.17 @100% | 13 @50% |
Tensile Strength, Mpa | 19.5 | 8.96 | 22 |
Elongation, % | 80 | 170 | 100 |
Color | Black | Black | Black |
Compression set,70h@204 Deg.C % | 33 | 53 | 29 |
Chemical processing environments expose sealing materials to aggressive chemicals, extreme temperatures, and harsh mechanical conditions. Kalrez® perfluoroelastomer parts, are engineered to offer superior chemical resistance, thermal stability, and long-term durability—making them the industry benchmark for sealing reliability in the chemical and specialty chemical industries.
| Chemical Processing | Kalrez 6375 | Kalrez 7075 | Kalrez 7275 | Kalrez 7375 | Kalrez 6380 |
| Maximum Service Temp., Deg. C | 275 | 327 | 300 | 300 | 225 |
| Lowest Service Temp., Deg. C | -20 | -18 | -20 | -20 | -22 |
| Shore A Hardness | 75 | 75 | 75 | 77 | 80 |
| Modulus100 %, Mpa | 9.1 | 11.2 | 9.7 | 15.2 | 6.9 |
| Tensile Strength, Mpa | 15.2 | 17.2 | 14.5 | 20 | 15.9 |
| Elongation, % | 160 | 138 | 160 | 115 | 160 |
| Color | Black | Black | Light Brown | Black | Cream |
| Compression set,70h@204 Deg.C % | 24 | 10 | 22 | 9 | 42 |
Kalrez® perfluoroelastomer parts, developed by DuPont™, are industry-leading sealing solutions engineered to perform reliably in the ultra-clean, high-temperature, and chemically aggressive environments of semiconductor manufacturing. These seals offer unmatched purity, long life, and reduced contamination risk—making them ideal for critical wafer processing tools.
Used to create micro-scale patterns on wafers, plasma etching involves highly reactive gases like CF₄, SF₆, and O₂. Seals in these chambers face intense chemical attack, thermal cycling, and risk of particle contamination due to erosion.
CVD tools deposit thin films on wafers by reacting gaseous precursors at high temperatures. Seals are subjected to aggressive gases, pressure/vacuum cycling, and elevated temperatures exceeding 300°C.
Used to create micro-scale patterns on wafers, plasma etching involves highly reactive gases like CF₄, SF₆, and O₂. Seals in these chambers face intense chemical attack, thermal cycling, and risk of particle contamination due to erosion.
CVD tools deposit thin films on wafers by reacting gaseous precursors at high temperatures. Seals are subjected to aggressive gases, pressure/vacuum cycling, and elevated temperatures exceeding 300°C.
| Kalrez® Grade | Application | Maximum Temperature | Process Type | Chemistries |
| Kalrez® 9100/9500 | Plasma Processes | 150°C to 300°C | HDPCVD, SACVD/FCVD, Conductor Etch | TMS, TEOS, O₂, NH₃, CF₄, NF₃, HBr, SiF₄ and similar |
| Kalrez® 9600 | PECVD/PEALD | Up to 275°C | Plasma Processes | TMS, DEMS, SiH₄, N₂O, NH₃ and similar |
| Kalrez® 8705/9300 | PECVD Curing, Ash/Strip | 150°C to 250°C | Plasma Processes | O₂, UV light, CHF₃, H₂O vapor, Forming gas |
| Kalrez® 8900/7075UP | Thermal Processes (ALD/LPCVD) | 250°C to 300°C | Thermal Processes | WF₆, TiCl₄, HF, F₂, O₂, H₂O, Cl₂ |
| Kalrez® 7075UP/8900 | Oxidation/Nitridation | 280°C to 300°C | Thermal Processes | N₂, H₂O vapor, HCl, Cl₂, O₂ |
| Kalrez® 8575 | Lamp Anneal/RTP | 250°C to 275°C | Thermal Processes | Infrared light, O₂, H₂O vapor |
| Kalrez® 9300/9600 | Wafer Surface Prep, Wet Processes | 200°C to 275°C | Wafer Surface Prep, Ash/Strip | NF₃, HF, H₂, NH₃, EKC fluids |
| Kalrez® W240UP | Etching, Stripping, Copper Plating | 70°C to 125°C | Wet Processes | HNO₃, HF, NH₄OH, NMP, acetone, DMSO, CuSO₄ solution, H₂SO₄ |